• <tr id='Nbp9Hn'><strong id='Nbp9Hn'></strong><small id='Nbp9Hn'></small><button id='Nbp9Hn'></button><li id='Nbp9Hn'><noscript id='Nbp9Hn'><big id='Nbp9Hn'></big><dt id='Nbp9Hn'></dt></noscript></li></tr><ol id='Nbp9Hn'><option id='Nbp9Hn'><table id='Nbp9Hn'><blockquote id='Nbp9Hn'><tbody id='Nbp9Hn'></tbody></blockquote></table></option></ol><u id='Nbp9Hn'></u><kbd id='Nbp9Hn'><kbd id='Nbp9Hn'></kbd></kbd>

    <code id='Nbp9Hn'><strong id='Nbp9Hn'></strong></code>

    <fieldset id='Nbp9Hn'></fieldset>
          <span id='Nbp9Hn'></span>

              <ins id='Nbp9Hn'></ins>
              <acronym id='Nbp9Hn'><em id='Nbp9Hn'></em><td id='Nbp9Hn'><div id='Nbp9Hn'></div></td></acronym><address id='Nbp9Hn'><big id='Nbp9Hn'><big id='Nbp9Hn'></big><legend id='Nbp9Hn'></legend></big></address>

              <i id='Nbp9Hn'><div id='Nbp9Hn'><ins id='Nbp9Hn'></ins></div></i>
              <i id='Nbp9Hn'></i>
            1. <dl id='Nbp9Hn'></dl>
              1. <blockquote id='Nbp9Hn'><q id='Nbp9Hn'><noscript id='Nbp9Hn'></noscript><dt id='Nbp9Hn'></dt></q></blockquote><noframes id='Nbp9Hn'><i id='Nbp9Hn'></i>



                More Infotmation






                Allround Trading co., Ltd. PRODUCTS


                DHS SERIES SYSTEM.DHS8000
                Automatic Barcode Printing and Labelling System

                The main purpose of DHS8000 system design is to replace labour force and reduce human error that may occur during the process of placing the sticker label (wafer ID) on frame wafers. DHS8000 consists of 2 main modules, one functions as an OCR reader and the other a barcode printer. The wafer ID printed on wafers will be read by the OCR. The system will then convert the wafer ID into barcode format and print it on a sticker label, nally placing it on the wafer tape.
                DIS SERIES SYSTEM.DIS3000 & DIS8000
                Post Dicing Inspection System

                DIS8000 is designed to handle frame wafers post wafer dicing process. It is able to inspect defects that are observable prior to dicing and also die defects resulted post dicing process. It's equipped with two types of defect identication methods, inking on the defective die and wafer map containing locations of the defective die with classication. The system is capable of performing wafer backside inspection.
                ISP SERIES SYSTEM ISP3100 & ISP3100V & PWB1000V
                Automatic Post Wire Bond Inspection System

                ISP3100V is an automatic optical inspection system designed to handle lead frames or substrates for visual inspection and yield management after die attach and wire bonding process. It's equipped with high resolution camera system, strip mapping system and auto-conversion for different types of packages. It's capable to perform physical marking with various types of reject identication module such as puncher, wire breaker, bristle, scriber and inker.
                LSI SERIES SYSTEM.LSI1000
                Strip Laser Marking Handler System

                LSI1000 is designed to perform the laser mark on lead frames and substrates. This system can be applied to either 2D Matrix Code marking or package marking on lead frames and substrates. It's also equipped with lead frames and substrates orientation checker, post mark quality check station and post mark cleaning station with air blower.
                NIM SERIES SYSTEM.NIM1100
                Pogo Pin Insertion System

                NIM1100 is designed to perform the pogo pins insertion process. It consists of 4 modules, namely singulator, orientation checker, buffer and nozzle. It's equipped with dual camera system for efcient calibration, double purge features to reduce pin missing and false nozzle jam alarm. The system consists of key lock switch to disable the start and reset button function for safety purpose when the user is away from the machine.
                SAC SERIES SYSTEM.SAC-2.Fully Programmable Logic Control

                CREDEN compact precision steam aging chamber is specifically designed to generate artificial aging of all electronic components and circuit boards, including high density, discrete components. This is done by producing a saturated steam flow in a chamber and 2 drawers which followed United States standard with 60 meshes per inch provided for small sample testing.

                Wafer Sorter System

                WHS8000 is designed with 2 load ports and is upgradeable to 3. It is congurable to handle 300mm wafer in FOUP or FOSB, and 200mm wafer in open cassette without conversion. The optional OCR vision system will read the wafer ID and communicate with the host computer for its sorting destination. Alternatively, there are other direct sorting methods which are programmable by the user. This machine uses R robotic arm to ensure fast and precise handling.
                WIS SERIES SYSTEM.WIS1000 & 8000

                Post Probing Inspection System

                WIS8000 is designed to handle 8" and 12" wafer for visual inspection using high power metallurgical microscope. The system is equipped with 2 FOUP load ports, macro and micro inspection complete with wafer mapping system. WIS8000 comes with a clean room ATM robot which is integrated with single fork-type aluminium end effector to hold wafers at its back surface by vacuum suction.