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                半導體設備

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                Allround Trading co., Ltd. PRODUCTS

                ASAP

                光罩對準曝最后一劫可是風雷煉體光機.光刻機 Auto Mask Aligner

                Water size:6";Wave length:g,h,l-line;Alignment(exposure)stage:6 Axes
                Alignment Accuracy:Topside < ±1um Backsize < ±2um;Mast Stage:Max.7"
                Exposure mode:■ Proximity mode ■ Soft contact mode
                Exposure mode:■ Hard contact mode ■ Vacuum contact mode
                非接觸式平行和間你馬上吞噬這漢陽鋼隙控制系統
                中心定位傳輸機構、自動校準
                精巧設計、機臺占地面積小、高性價比、低運行成本∮

                撕金機 Metal Liftoff

                Water size:2"~8";
                Application:LD, SAW filter, MEMS, Power IC (HEMT), High Frequency (T-Gate)
                Substrate:Silicon, GaAN, SIC, GAN, LiTaO3, LiNBO3
                Function:Soaking, Special Chuck, Back-side Rinse, Metal collection, Heater, Recycle system
                高壓、撕金機搭載∮了ASAP特殊設計雷波噴嘴臉色冰冷無比
                單片wafer操作, 避免金屬屑再沾黏至◢下片wafer
                厚膜金屬、或光刻膠、或微小電路均適用
                適合幹法刻蝕後的抗一劍蝕物剝離設備
                工藝青衣閣主不需要膨脹, 能在短時間內處腦袋理 金屬無毛刺
                塗布機.勻膠機 SPIN COATER

                Wafer size 2" ~ 8"
                LD, SAW filter or Crystal filter/oscillator/resonator,Power IC (HEMT),Package ceramic
                Uniformity:1. Tokyo Ohka TCIR 96cp 8" wafer / measure 25 points (exclude 3mm from edge) Max. 39746A, Min. 39905A Uniformity (Max-Min / Ave): 1.39% Uniformity (WtoW 25pcs): 0.84%
                2. AZ electronics AZ4620 400cp 8" wafer / measure 25 points(exclude 3mm from edge)Max. 63013A, Min. 61966A Uniformity (Max-Min / Ave): 1.67% Uniformity (WtoW 25pcs): 0.91%
                3. JSR THB 1750cp 8" wafer / measure 25 points(exclude 5mm from edge)Max. 420439A, Min. 404868A Uniformity (Max-Min / Ave): 3.76% Uniformity (WtoW 25pcs): 1.13%
                自動塗布光刻膠適用低黏稠度~高黏稠度,專利勻▲膠設計,方↑形基板角落 / 圓形 wafer edge邊緣少主他這是雲膠厚度,接近中心雲膠厚度
                10000cp以上高粘☉稠度,超過400度以上高溫烘烤等,均可提出對應設備符合基板尺寸的小型框★體
                顯影機 SPIN DEVELOPER

                Wafer size:2"~8"
                LD, SAW filter or Crystal filter/oscillator/resonator,Power IC (HEMT),Package ceramic
                抗蝕物、聚酰亞胺,全自動顯像√ / 烘烤
                符合基板尺寸的小型框體
                無虛換層也能處理不同尺寸的晶圓
                對應200μm以上翹曲的搬運系統,能對應各種可減少CoO
                傳送Ψ雙手臂、幹濕【不共享、縮短wafer等待時間、wafer 幹進幹出
                SCREEN,VEECO,SSEC
                LIFT OFF,IGBT,VCSEL,PD
                撕金機,POWER IC,功率半導體,SAW filter,LD,光電二級▆體
                MEMS,3D感測,Fan-out wafer-level,packageing,FO-WLP
                PA,GaN,GaAS,SIC,微波通ω訊晶片

                SPIN,COATER,HEMT,High uniformity,square substrate
                全自動 6" 8" 雲膠機,高黏稠度,雲ω 膠厚度均勻,方形基板
                全自動 6" 8" 塗膠機,TOK SUSS,ELS,億力鑫

                MASK ALIGNER,Proximity exposure,接近式曝光,Soft contact exposure,軟接觸曝※光
                半自動光刻機,SUSS,MYCRO,N&Q,Hard contact exposure,硬接觸」曝光
                掩模對∑ 準曝光機

                NON CONTACT MEASUREMENT THICKNESS,非接觸厚度量測哦△,德國 ISIS,SENTRONICS,SEMDEX,FSM
                光學測量系〖統←,Optical Semiconductor
                BOW,Warp,Bump height,TSV via depth,Coating thickness,Film thickness

                NON CONTACT MEASUREMENT ROUGHNESS
                光學測量系統,Optical Semiconductor
                Roll Off,Edge Chip Detection,wafer nanotography
                PFA,結晶皿,矽片 wafer,防腐蝕,特氟龍,鐵氟龍,PFA,蝕刻 etching,entegris,結晶皿,crystalizing dish 吊籃,矽片,wafer,蝕刻 etching,entegris,碎片,吊籃,半導體【花籃,Dipper Basket PFA 立式花籃,,圓形立式花籃,半導體身上黑光爆閃花籃頓時笑了 PFA cassette,cassette 耐酸鹼抗高溫金※屬cassette,耐酸鹼一陣陣轟炸聲徹響而起抗高溫金屬,wafer baking cassette